MACOM Technology Solutions Inc. has unveiled a series of 25-Gbps distributed feedback (DFB) lasers for 5G LTE wireless fronthaul applications. Available in bare die chip format (1xxD-25I-LCT11-50x) and TO-packaging (1xxD-25I-LT5xC-50x), the 25G DFB lasers will operate in the -40 to 85oC temperature range over transmission distances from 2 to 10 km, MACOM asserts. The lasers are in sampling, with production availability planned for 2019.
The lasers leverage MACOM’s Etched Facet Technology (EFT), which it gained with the acquisition of BinOptics (see “MACOM to add laser technology via BinOptics acquisition” and “MACOM 25-Gbps etched facet lasers reach production”). The technology enables high yields and lower costs, the company says.
“MACOM’s new 5G LTE-optimized 25G laser family builds on our comprehensive portfolio of 5G enabling technologies, and again demonstrates the value of EFT for achieving production efficiency that scales to meet industry supply and cost structure needs,” said Dr. Fang Wang, vice president and business line manager, lightwave, at MACOM. “For customers transitioning from 10G to 25G wireless fronthaul infrastructure, MACOM can provide the 25G lasers, complementary components and application expertise to help accelerate deployment time and reduce costs.”
MACOM will exhibit the 25-Gbps lasers this week at the China International Optoelectronic Exposition (CIOE), Booth #1A32, in Shenzhen, China, and later in the month at the European Conference on Optical Communication (ECOC), Booth #579, in Rome, Italy, September 24–26.
For related articles, visit the Optical Technologies Topic Center.
For more information on optical components and suppliers, visit the Lightwave Buyer’s Guide.