Centellax unveils 32-Gbaud linear modulator driver amplifier IC chipset for DP-16QAM

High-speed analog component supplier Centellax Inc. has released the OA3MM2C, an amplifier IC chipset that comprises one input and one output amplifier chip. The chipset offers small footprint, high performance, and low cost for 32-Gbaud linear transponder applications, Centellax asserts. The chip set could be used as a building block to enable designers to leverage multiple channels to meet application integration needs, the company adds.

Centallax says it has designed the OA3MM2C with gain and power levels well suited for advanced optical modulation formats such as DP-16QAM at 32 Gbaud and beyond. The amplifier chips also can be used for broadband 32-Gbps DP-QPSK applications with higher input amplitude signal.

Additional features of the OA3MM2C chip set include:

  • 20-dB gain overall
  • applicability to linear and limiting applications
  • die footprints of 1640 x 920 um (64.6 x 36.2 mil) per chip
  • integrated temperature sensors and power detectors
  • 1.4 W typical power dissipation per chip set operating in linear mode
  • low harmonic distortion
  • flat group delay.

“Our linear modules and linear driver chipset have been very well received by our DP-16QAM and DP-QPSK customer base. With superior bandwidth, flatness, noise, and amplitude linearity, we believe Centellax linear products are the best on the market. These features have helped Centellax with key design wins with our Tier 1 customers,” states Jay de la Barre, Centellax vice president of worldwide sales.

Centellax currently offers both a dual-input and quad-input module version of the chipset and plans to offer a surface-mount option as well.

For more information on communications ICs and suppliers, visit the Lightwave Buyer’s Guide.

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