Eugenlight Technologies, a specialist in optoelectronic integrated devices, officially launched its UHP ELSFP (External Laser Small Form Factor Pluggable) external laser source module product series.

As global hyperscalers accelerate the product verification and gradual mass production of (Near-Package Optics) and CPO (Co-Packaged Optics) switches, NPO/CPO technology is widely recognized as the inevitable trend for next-generation AI intelligent computing clusters, supercomputing centers, and high-density data centers. As a core component of NPO/CPO switch systems, the pluggable external laser source (ELSFP) physically isolates heat-sensitive lasers from core electrical chips.

Proprietary Process Establishes Leading Coupling Efficiency

Eugenlight's newly released ELSFP product series complies with the OIF-ELSFP-02.0 protocol, integrating dual 12-fiber MT ferrule connectors with insertion loss below 0.3 dB. Each channel employs low-bend-loss polarization-maintaining fiber with a polarization extinction ratio (PER) > 20 dB. Notably, Eugenlight has independently developed an automated lens and fiber array unit (FAU) coupling and curing system based on its own process design. This coupling and curing equipment achieves optical coupling repeatability error < 3%, inter-channel deviation < 3%, and post-curing variation error < 5%. The self-made lens and FA coupling equipment perfectly matches the product structure and optical path design, significantly improving coupling efficiency and mass production consistency. The chip-to-fiber batch production coupling efficiency can reach over 85%, highlighting Eugenlight's technical competitiveness in the optoelectronic integrated packaging field.

Eugenlight's ELSFP products adopt a Socket connector design, featuring short connection distance, low insertion loss, and easy disassembly and maintenance of devices and PCBA. The heat dissipation surface is in full contact with the upper cover. The extreme optical coupling efficiency combined with effective thermal management enables each channel to achieve > 23 dBm output power with a single-channel drive current < 1 A. The overall power consumption of the ELSFP module is measured to be as low as 13.5 W, placing Eugenlight's ELSFP comprehensive performance in the industry's leading ranks.

Accelerating Mass Production to Meet Domestic and Overseas NPO/CPO Customer Demand

Eugenlight's ELSFP VHP and UHP series engineering samples (ES) have been completed from Q4 2025 to Q2 2026. The pilot run is planned for Q3–Q4 2026, with mass production (CA) expected to commence in Q1 2027. Meanwhile, depending on market demand, the company will leverage its parent company USI (Shanghai Stock Exchange ticker: 601231) and its manufacturing base in Haiphong, Vietnam, to simultaneously achieve customer-specific development, product transfer, and large-scale manufacturing in both Chengdu and Haiphong, meeting the market demand for domestic and overseas NPO/CPO applications.

Eugenlight's ELSFP module will be demonstrated live at the CIOE (China International Optoelectronic Exposition) held at the Shenzhen World Exhibition & Convention Center from September 9–11 (Hall 13, Booth 13A28). In addition to the ELSFP module, Eugenlight will also demonstrate its ITLA supporting 1.6T coherent transmission and its 1.6T silicon photonics engine products on-site. Industry professionals are welcome to visit for guidance and exchange.

About Eugenlight Technologies

Eugenlight Technologies Co., Ltd. was founded in October 2016, focusing on the R&D, manufacturing, and sales of high-speed optoelectronic integrated components and optical engine products. The company is committed to providing competitive optical interconnect solutions for data centers, optical transmission/access, and other applications.

As a leading optoelectronic integration technology supplier, Eugenlight possesses mass production product lines for high-performance, high-reliability optoelectronic integrated devices and optical engines ranging from 100G to 1.6T rates, as well as capabilities in silicon photonics integration, 2.5D heterogeneous optoelectronic integration, and NPO/CPO co-packaged optics. With leading technical strength and reliable product quality, Eugenlight has become a partner to multiple top-tier global optical interconnect enterprises, with its key products entering the core supply chain of the global optical communications industry.

In January 2026, Eugenlight joined USI (Shanghai Stock Exchange ticker: 601231), becoming a key member of USI's global optical interconnect ecosystem.

Eugenlight's vision is to drive the mass production of next-generation NPO/CPO through business synergy with USI and its parent company ASE HOLDINGS, and to become a core supplier in the global optical interconnect field.