Offes epitaxial growth, device fabrication and testing, device packaging and module assembly. In-house design/manufacturing resources and extensive process libraries enable rapid delivery of high performance devices at competitive costs.
Contact and E-Beam Lithography, E-Beam & Thermal Metal Deposition, Solder Deposition, Electroplating and Electroless Plating, Wet and Dry Etching of Semiconductor and Dielectric...