G.fast chips subject of Broadband Forum plugfest

The Broadband Forum put G.fast devices from seven companies through an interoperability demo at the University of New Hampshire InterOperability Laboratory (UNH-IOL) January 26-30.

The Broadband Forum put G.fast devices from seven companies through an interoperability demo at the University of New Hampshire InterOperability Laboratory (UNH-IOL) January 26-30.

The plugfest, the first of its kind, enabled the companies to demonstrate how well they conform to the interoperability aspects of the ITU-T's recently approved G.9701 G.fast specification (see "G.fast standard ratified by ITU"). G.fast aims to support transmission speeds as high as 1 Gbps over existing twisted-pair copper cabling.

Semiconductor companies participating in the event included Broadcom, HiSilicon, Ikanos, Lantiq, Metanoia, Realtek, and Sckipio. Broadcom and Sckipio have hit the market first with G.fast node and CPE chip announcements (see "Broadcom debuts end-to-end G.fast offering" and "G.fast chipsets from Sckipio Technologies debut").

Sparnex Instruments provided a G.fast copper loop simulator for the event.

"We see the interoperability of these technologies as one of the major driving forces of our member companies," said Robin Mersh, Broadband Forum CEO. "The Forum's interoperability programs also extend beyond plugfest events, to certification programs for TR-069, GPON, and will soon include certification of G.fast interfaces as well. These events are the first step in working with member companies to provide interoperable G.fast solutions to the market."

The Broadband Forum and UNH-IOL plan to hold additional G.fast events, with the next slated for March 9-13, 2015 at the UNH-IOL facilities. The two organizations expect equipment developers to bring system-level technology at some point. Meanwhile, the Broadband Forum expects to begin certification tests in the second half of 2015.

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