Phononic Non-Hermetic Thermoelectric Cooler

Feb. 20, 2019
Phononic’s Non-Hermetic Thermoelectric Cooler (TEC) is designed to provide high reliability and cooling performance alongside lower power consumption for cooled, non-hermetic laser packaging. Applicable to a wide range of TEC designs, the device performance and reliability targets for subcomponents within telecommunication and data center applications. Typical non-hermetic laser packages that also feature TEC cooling can face multiple environmental challenges that limit performance and reliability of the laser chips, the TEC, and other TOSA components. 
Phononic’s Non-Hermetic Thermoelectric Cooler (TEC) is designed to provide high reliability and cooling performance alongside lower power consumption for cooled, non-hermetic laser packaging. Applicable to a wide range of TEC designs, the device performance and reliability targets for subcomponents within telecommunication and data center applications. Typical non-hermetic laser packages that also feature TEC cooling can face multiple environmental challenges that limit performance and reliability of the laser chips, the TEC, and other TOSA components. Phononic says its non-hermetic TEC platform solves many of these issues by providing a robust, reliable cooler that exhibits dramatically increased survivability in high heat and humidity.

Judge’s comment: “Any product that helpsreduce power consumption is critical in today's systems. This looks like a unique product that has immediate application in optical equipment.”

Return to the 2019 Lightwave Innovation Reviews Honorees page

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