Startup AvicenaTech Corp. is using this week’s OFC 2022 to demonstrate its microLED-based LightBundle multi-terabit chip-to-chip interconnect technology. The demonstration leverages microLED technology from Lumileds.
Avicena emerged last year with an approach to chip-to-chip interconnect that combines microLED optical sources with multicore fiber (see “Avicena touts LED-based LightBundle optical interconnects for chip-to-chip communication”). The company asserts its approach matches well with parallel chiplet interfaces such as UCIe, OpenHBI, and BoW and can extend the reach of compute interconnects like PCIe/CXL, HBM/DDR/GDDR memory links, as well as inter-processor interconnects like NVLink – all with low power and latency.
“We have already demonstrated LightBundle links at less than 2pJ/bit using our LightBundle technology,” said Bardia Pezeshki, founder and CEO of Avicena, “and will soon demonstrate sub-1pJ/bit links.”
A LightBundle comprises arrays of GaN micro-emitters that leverage the microLED display ecosystem; Avicena says they can be integrated onto CMOS ICs. Avicena is working with Lumileds to ramp production of these microLED arrays.
“Our optimized links support up to 10 Gbps per lane over -40°C to +125°C temperature with excellent reliability,” said Pezeshki. “A LightBundle interconnect uses hundreds of parallel optical lanes connecting microLED arrays to CMOS-compatible PD arrays over multi-core fiber to create low-cost multi-Tbps interconnects with a 10-m reach.”
“Avicena’s demonstration of record low-power consumption with its LightBundle interconnect technology is proof of the advances Lumileds has made in microLEDs,” asserted Willem Sillevis-Smitt, head of marketing at Lumileds. “We are looking forward to enabling vastly lower power in data center interconnects.”
Avicena is showcasing the LightBundle technology during OFC at Booth 3351.
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