BinOptics intros 1310-nm Horizontal-Cavity Surface-Emitting Laser

April 29, 2004 Ithaca, NY -- BinOptics Corp. has developed a new class of surface-emitting lasers manufactured using its proprietary etched facet technology platform. The new Horizontal Cavity Surface Emitting Laser (HCSEL) combines the power and high reliability of an edge-emitting laser with the low cost and ease of packaging of a vertical cavity surface-emitting laser (VCSEL).

Apr 29th, 2004

April 29, 2004 Ithaca, NY -- BinOptics Corp., developer of integrated microphotonic devices, has announced the availability of a new class of surface-emitting lasers manufactured using its proprietary etched facet technology platform. The new Horizontal Cavity Surface Emitting Laser (HCSEL) combines the power and high reliability of an edge-emitting laser with the low cost and ease of packaging of a vertical cavity surface-emitting laser (VCSEL).

The BinOptics device integrates a horizontal laser cavity with a 45-degree etched reflecting mirror to direct the output beam vertically. The first product is a 1310-nm Fabry-Perot (FP) laser designed for uncooled operation at data rates of 2.5 Gbits/sec with an optical output power of 20 mW and a slope efficiency of up to 0.3 W/A. The product is available with or without an integrated monitoring photodetector (MPD). BinOptics contends that its surface-emitting laser offers unparalleled value while filling the existing gap between long-wavelength VCSELs and conventional FP lasers.

The advantages of VCSELs operating at 850 nm were so compelling that VCSELs replaced all standard transmitters in local area networks within two years of first commercial availability. These benefits include on-wafer testing; the ability to fabricate one and two dimensional arrays on the same chip for easy coupling with fiber arrays or electronics; and side-by-side integration with detectors enabling low cost integrated transceivers. These advantages have not been realized for VCSELs at 1310 nm, say company representatives, because of materials issues that lead to low power and poor yield, negating most of the cost benefits.

According to BinOptics, its 1310-nm HCSEL delivers all the above advantages and more. It uses proven edge-emitting materials and the company's unique etched facet technology to achieve a new level of cost-effectiveness and performance. In addition, it allows monolithic integration of the MPD to further reduce cost. The BinOptics HCSEL is designed to be the technology of choice for applications where cost and compact size are critical, such as Ethernet, access, and passive optical networking (PON), says the company.

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