Senko Advanced Components, Inc. says it has purchased CudoForm, which designs and manufactures metal micro-optic components for a variety of applications, for an undisclosed sum. While CudoForm has targeted such applications data communications, consumer photonics, and biosafety for its products, a source at SENKO said that the company’s micro-mirror connector and its potential application to co-packaged optics (CPO) was the primary driver.
Founded in 2019 by CEO and CTO Ryan Vallance and headquartered in Camarillo, CA, CudoForm uses a proprietary stamping technology to create high-precision metallic components for optical applications. CudoForm asserts its stamping approach represents a lower-cost, more scalable approach compared to alternatives such as diamond turning and produce more robust and reliable products than plastic injection molding. In addition to the micro-mirror connector, the company uses its technique to make metallic optical benches and metallic optical reflectors.
"The employees and management of CudoForm are excited to join SENKO,” said Vallance, who has joined SENKO after the transaction. “We recognize the importance of high-precision and reliable connectivity for CPO and with the combination of CudoForm and SENKO, we bring together complementary technology platforms to provide novel solutions that meet the demanding requirements of this tight spaced packaging and difficult to integrate photonics ecosystem.”
Simone Baldassarri, marketing manager at Senko Advanced Components, says that his company will market the new components under the CudoForm brand and that the CudoForm staff will remain in California. While the micro-mirror connector for CPO will be the initial focus, Baldassarri says that SENKO is interested in leveraging the other two products to address additional markets, such as 3D and virtual reality imaging, LIDAR, digital health and sensing, and solid-state lighting and UVC LED pathogen reduction.
"We are very happy about this acquisition, especially because CudoForm is a world leader when it comes to optical interconnectivity,” commented Kazu Takano, president of Senko Advanced Components. “By merging their research and innovative solutions with our expertise we will be able to improve our product development and further strengthen our position in the market. Both organizations share a common mission to deliver the highest performance and innovations to our customers. We look forward to delivering the combined synergies of two industry-leading companies to our customers."
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