OIF completes co-packaging framework Implementation Agreement
OIF says its members have completed work on a framework Implementation Agreement (IA) for co-packaging. The framework, the first in a series of releases from the OIF that will apply to co-packaged optics (CPO), identifies what the organization called “the critical co-packaged applications and their requirements,” which will guide the development of interoperability standards.
The group announced its intention to dive into CPO via the development of a framework IA in November 2020 (see “OIF targets Co-Packaging Framework Implementation Agreement”), under the auspices of OIF’s Physical & Link Layer (PLL) Working Group. That effort included the study of applications as well as related technology areas such as electrical and optical interfaces, thermal and mechanical considerations, reliability, safety, environmental and management interfaces. The framework IA summarizes this work.
Development of the framework IA has led to the creation of a pair of CPO-related projects, the 3.2T Module Project announced in March 2021 and the External Laser Small Form Factor Pluggable (ELSFP) Project announced in May 2021.
“OIF is leading industry discussion on this critical dense integration technology,” said Jeff Hutchins of Ranovus and OIF Board Member and PLL Working Group – Co-Packaging vice chair. “This framework IA provides the industry with a foundation for developing interoperable energy efficient co-packaged solutions.”
“Co-packaging represents a significant change to the way high-performance communications ASICs are packaged today,” added technical editor of the Co-Packaging Framework IA, Kenneth Jackson of Sumitomo Electric. “This framework document addresses many of the issues that initially challenged this new architecture and narrows the scope of achievable solutions. This is precisely what OIF excels at…identifying a gap and collaborating on a path forward towards interoperability.”
The framework document is available from the OIF website. OIF presented a webcast on its work in CPO with Lightwave earlier this month that is available for viewing on demand.
For related articles, visit the Optical Techhnology Topic Center.
For more information on optical components and suppliers, visit the Lightwave Buyer’s Guide.
To stay abreast of optical communications technology, subscribe to Lightwave’s Enabling Technologies Newsletter.
Stephen Hardy | Editorial Director and Associate Publisher, Lightwave
Stephen Hardy is editorial director and associate publisher of Lightwave and Broadband Technology Report, part of the Lighting & Technology Group at Endeavor Business Media. Stephen is responsible for establishing and executing editorial strategy across the both brands’ websites, email newsletters, events, and other information products. He has covered the fiber-optics space for more than 20 years, and communications and technology for more than 35 years. During his tenure, Lightwave has received awards from Folio: and the American Society of Business Press Editors (ASBPE) for editorial excellence. Prior to joining Lightwave in 1997, Stephen worked for Telecommunications magazine and the Journal of Electronic Defense.
Stephen has moderated panels at numerous events, including the Optica Executive Forum, ECOC, and SCTE Cable-Tec Expo. He also is program director for the Lightwave Innovation Reviews and the Diamond Technology Reviews.
He has written numerous articles in all aspects of optical communications and fiber-optic networks, including fiber to the home (FTTH), PON, optical components, DWDM, fiber cables, packet optical transport, optical transceivers, lasers, fiber optic testing, and more.
You can connect with Stephen on LinkedIn as well as Twitter.