Integrated optical component developer POET Technologies Inc. (TSX Venture: PTK; NASDAQ: POET) says it is now sampling 400G FR4 and 800G 2xFR4 receive optical engines (RXOEs). The company also revealed that Luxshare Technology Co., Ltd., a subsidiary of Luxshare Precision Industry Co., Ltd. of Dongguan, China, will be a lead customer for the devices.
The POET 400G FR4 RXOE integrates a quad trans-impedance amplifier (TIA), four high-speed photodiodes, and an optical demultiplexer in a single 12x5-mm chiplet. The 800G 2xFR4 RXOE comprises an integrated octal TIA, eight high-speed photodiodes, and two optical demultiplexers in a 15.5-mm chiplet. The RXOEs also are available with an integrated fiber array unit (FAU). The devices exceed the specifications for 400GBASE-FR4 interfaces, POET asserts.
POET expects to complete design verification testing and reliability qualification of the RXOEs in the first half of this year, with production launching in the second half. Super Photonics Xiamen, the company’s joint venture with Xiamen Sanan Integrated Circuit Co., Ltd., will produce the devices.
“The 400G and 800G FR4 RXOEs are the first of their kind to integrate photonic and electronic components on a single interposer chiplet. We expect customers to benefit from the simplified design, superior performance, and lower cost offered by POET’s wafer-scale integration and passive assembly of components,” said Raju Kankipati, vice president of product management at POET.
“We are excited to work with LuxshareTech as a lead customer,” Kankipati continued. “LuxshareTech’s experience in designing and manufacturing high-speed optical transceivers and POET’s innovative technology can be mutually beneficial in bringing high-volume and low-cost solutions to the data center market.”
"LuxshareTech is focused on expanding its 400G and 800G pluggable transceivers portfolio for the data center market,” said Mike Gao, GM of LuxshareTech’s opto-electronic business unit. "We are pleased to work with POET Technologies and use their highly integrated chiplet platform to enable us to achieve a solution with superior performance and ease of compact module assembly.”
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