HieFo addresses coherent market with high-power DFB laser chip
HieFo meets the demanding requirements of Coherent Optical transmission by combining lower optical output power with narrow line width performance with its HCL30 DFB laser product line.
Available in both O and C bands (in various industry-standard wavelengths), the HCL30 DFB line has been developed for and addresses what HieFo calls the “coherent lite” market requirements.
The product line is also applicable in the data center, AI connectivity, telecom, and general sensing segments.
A big focus of the HCL30 DFB laser product line is options.
HieFo’s HCL30 is a 1mm cavity-length chip available in bare die format or as a chip-on-carrier (COC) mounted on a proprietary submount. The device delivers 150 mW typical optical output power while achieving spectral line width performance of less than 300 KHz. The HCL30 is an ideal solution for integration in today’s highly integrated optical platforms employed in SiPh-based designs. Emerging co-packaged optics (CPO) and linear pluggable optics (LPO) technologies can also leverage the performance of this newly released laser chip.
The HCL30 is the first new DFB laser product released due to HieFo’s recent innovations in fundamental InP chip design architecture. HieFo plans to release additional product variations at a later date that address specific optical design requirements, such as high efficiency for ultra-high optical output power or extremely narrow line width performance.
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