Burst-mode XG-PON1 for FTTH Vitesse chipset target

Vitesse Semiconductor Corp. (NASDAQ: VTSS) has introduced what it asserts is the first XG-PON1 OLT receiver chipset that can support burst-mode operation. Vitesse’s PON PRO chipset comprises the VSC7719 transimpedance amplifier (TIA) and VSC7729 post amplifier.

“Today’s XG-PON1 solutions are mostly discrete, requiring several components, and face space constraints and performance challenges that cannot be supported in volume production. Our new PON PRO architecture solves builds on Vitesse’s field-proven technology to solve these challenges and advance Ethernet throughout IP Edge networks,” said Aditi Vaghashia, who is responsible for product marketing within Vitesse’s connectivity group. “With its high degree of integration and burst-mode capabilities, Vitesse’s solution can be used in industry-standard SFP modules, making it easy to support our customers ramping production of their XG-PON1 systems.”

The new chipset architecture features on-chip monitoring of burst power for diagnostic purposes. Vitesse says that the PON PRO architecture’s integrated chip reset and monitor features obviate the need for external components to support burst mode operation. The set also offers APD sensitivity better than -33 dBm and overload performance better than -6 dBm, the company adds. Additional features include LVPECL/CML outputs and a reset through the data interface, which enables the use of standard TO-can headers in design of a BOSA. It also provides more than 24 dB of dynamic range, with support for all power budgets, including Class B+ and C.

“Few component vendors can offer a settling time capable of meeting GPON or XG-PON1 OLT requirements,” commented Dr. Simin Cai, president and CEO at Go!Foton Corp., parent company of PON module vendor Zenko Technologies. “Vitesse has established the expertise to offer proven burst-mode architectures for this market.”

The VSC7719 is sampling in bare die form, while the VSC7729 will be offered in a 16-pin 3-mm-square QFP-N package – small enough to fit in a SFF or SFP module along with a laser driver. Vaghashia tells Lightwave that the chipset is in trials with five or six customers. She expects the devices to be generally available either by the end of this year or the first quarter of 2013.

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