OIF members approved the start of the CEI (Common Electrical I/O) -224G Development Project at the organization’s recent Q3 2020 Technical and MA&E Committees Meeting, held virtually August 3-7. The meeting also featured a summary of the “Co-packaging of Optics with ASICs” members-only workshop that was held July 20 and a report on the results of the public Optical Module Management Interface Survey.
As its name implies, the CEI-224G Development Project’s goal is to develop at least one Implementation Agreement that covers 224-Gbps electrical interfaces. The resulting specifications will double the transmission rate of the current CEI-112G Implementation Agreement (see “OIF CEI-112G Project builds on existing 100-Gbps serial electrical links”). This opening initiative will see the development of a whitepaper that will report what OIF describes as “a consensus-based body of knowledge” regarding such high-speed I/O that will provide the basis for future CEI projects at this transmission rate.
“OIF strives to challenge our member companies to achieve more in order to accelerate industry innovation and standards that maintain alignment with network operator trends and needs,” explained Nathan Tracy, TE Connectivity and OIF president. “We are continually advocating for increased interoperability and the OIF quarterly meetings provide the ideal forum for members to debate and discuss the interoperability challenges that the industry is trying to overcome. For example, getting electrical signals to travel at 224 Gbps over workable distances is a challenge we are looking forward to exploring.”
As for the other main activities during the August meeting, OIF’s members-only “Co-packaging of Optics with ASICs” workshop held July 20, 2020 focused on challenges associated with co-packaged optics and opportunities for industry collaboration. Companies that provided speakers included Applied Optoelectronics, Inc., Facebook, Inphi, Intel, Keysight Technologies, Microsoft, Ranovus, Senko Advanced Components, Inc., and TE Connectivity. The membership now plans a similar workshop for the public, details of which OIF says it will announce soon.
Meanwhile, the Coherent Common Management Interface Specification Implementation Agreement survey sought input on the industry’s perception of that effort, the level of industry alignment, and whether there is support for further standardization of optical module management. The survey results are available for download from the OIF’s website. The survey showed an expectation that modules will increase in complexity, with programmability a common feature. The survey respondents also confirmed the importance of management interface specifications.
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